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该通用型光耦合器包含一个驱动硅光电晶体管的砷化镓红外发光二极管,采用 6 引脚双列直插封装。
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MSL Temp (°C)
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CTR (Min) (%)
CTR (Max) (%)
CTR tested @ IF (mA)
VCE(sat) (Max) (V)
BVCEO (Min) (V)
BVCBO (Min) (V)
BVECO (Min) (V)
ton (Max) (µs)
toff (Max) (µs)
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TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
H11A1M
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H11A1SM
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H11A1SR2M
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H11A1SR2VM
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H11A1TM
Obsolete
Pb
A
H
P
E-PKG AXIAL-LEADED GLASS DIODE
NA
-
BULK
1000
N
-
-
-
-
-
30
-
-
-
-
-
-
-
Price N/A
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H11A1TVM
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H11A1VM
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可靠性数据
Die Related Summary Data
Device: H11A1M
Equivalent to wafer fab process: GA,PD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
GA,PD
0
273679784
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)