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这些器件由砷化镓红外线发光二极管组成,二极管以光学方式耦合到单片硅光电晶体管检测器上,采用可表面帖装的小型塑料封装。 它们非常适合高密度应用,并且无需通过电路板安装。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channels
CTR (Min) (%)
CTR (Max) (%)
CTR tested @ IF (mA)
VCE(sat) (Max) (V)
BVCEO (Min) (V)
BVCBO (Min) (V)
BVECO (Min) (V)
ton (Max) (µs)
toff (Max) (µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
MOC207M
Active
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
N
1
100
200
10
0.4
70
70
7
7.5
5.7
2500
-40
100
$0.2567
More Details
MOC207R2M
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
N
1
100
200
10
0.4
70
70
7
7.5
5.7
2500
-40
100
$0.2337
More Details
MOC207R2VM
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
N
1
100
200
10
0.4
70
70
7
7.5
5.7
2500
-40
100
$0.2409
More Details
MOC207VM
Active
Pb
A
H
P
SOIC-8
1
260
TUBE
3000
N
1
100
200
10
0.4
70
70
7
7.5
5.7
2500
-40
100
$0.2441
More Details
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可靠性数据
Die Related Summary Data
Device: MOC207M
Equivalent to wafer fab process: GA,PD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
GA,PD
0
273679784
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)