TRIAC Driver Optocouplers | FODM3083

800V 5mA 零交叉，MFP

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概览

FODM306X 和 FODM308X 系列由于单片式硅检测器进行光耦合的红外发光二极管组成，执行零电压较差双向三端可控硅的功能，采用紧凑型的 4 引脚微型扁平封装。引线间距为 2.54mm。它们与双向三端可控硅一起用于逻辑系统与 115/240 VAC 线路供电设备的接口中，如固态继电器、工业控制器、电机、电磁装置和消费设备。

  • 消费型设备
  • 工业级电机

  • dv/dt保证值为600V/µs
  • 紧凑的4引脚表面帖装封装（2.4mm最大离板高度）
  • 电压过零检测
  • 峰值闭塞电压： 600V (FODM306X) 800V (FODM308X)
  • 可以卷带和卷盘形式提供，数量2500。
  • C-UL、UL和VDE认证（待审批）

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VDRM (Min) (V)

IFT (Max) (mA)

VTM (Max) (V)

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Commutating dV/dt (Min)

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IDRM (Max)

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Reference Price

FODM3083

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CAD Model

Pb

A

H

P

MFP-4

100AP

1

260

TUBE

3000

N

800

5

3

600

-

300

500

3750

$0.4419

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FODM3083R2

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CAD Model

Pb

A

H

P

MFP-4

100AP

1

260

REEL

2500

N

800

5

3

600

-

300

500

3750

$0.4428

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可靠性数据

Die Related Summary Data

Device: FODM3083

Equivalent to wafer fab process: BN,GA

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

BN,GA

0

252701301

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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