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MOC3081M、MOC3082M 和 MOC3083M 器件由一个与单片硅检测器进行光耦合的 GaAs 红外发光二极管组成,执行零电压交叉双侧三端双向可控硅驱动器的功能。此类器件可与分离功率三端双向可控硅开关元件一起用于逻辑系统与 240 VAC 线路供电的设备的接口,此类设备包括固态继电器、工业控件、电机、电磁阀和消费品设备等。
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Case Outline
MSL Type
MSL Temp (°C)
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Container Qty.
ON Target
VDRM (Min) (V)
IFT (Max) (mA)
VTM (Max) (V)
Static dV/dt (Min)
Commutating dV/dt (Min)
IH (Typ)
IDRM (Max)
VISO (Min)
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MOC3082M
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MOC3082SM
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MOC3082SR2M
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MOC3082SR2VM
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MOC3082SVM
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MOC3082TVM
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MOC3082VM
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可靠性数据
Die Related Summary Data
Device: MOC3082M
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)