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FOD410、FOD4108、FOD4116和FOD4118器件包含一个红外线发光二极管,该二极管耦合至采用两个反向并联SCR形成的混合三端双向可控硅开关,形成能够驱动分立式三端双向可控硅开关的三端双向可控硅开关功能。 FOD4116和FOD4118采用一个高效红外线发光二极管提供增强的触发灵敏度。 这些器件采用标准6引脚双列直插(DIP)封装。
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CAD Models
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
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Container Qty.
ON Target
VDRM (Min) (V)
IFT (Max) (mA)
VTM (Max) (V)
Static dV/dt (Min)
Commutating dV/dt (Min)
IH (Typ)
IDRM (Max)
VISO (Min)
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FOD410
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FOD410S
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FOD410SD
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FOD410SDV
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FOD410SV
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FOD410TV
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FOD410V
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可靠性数据
Die Related Summary Data
Device: FOD410
Equivalent to wafer fab process: GA,PD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
GA,PD
0
273679784
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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