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MOC3071M、MOC3072M 和 MOC3073M 由与非零交叉硅双向交流开关(三路器件)进行光耦合的 GaAs 红外发光二极管组成。此类器件将低电压逻辑与 240 VAC 线路进行隔离,可提供对于高电流三端双向可控硅元件或半导体闸流管的随机相控制。此类器件具有增强的静态 dv/dt 功能,可确保电感负载的稳定开关性能。
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MSL Type
MSL Temp (°C)
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Container Qty.
ON Target
VDRM (Min) (V)
IFT (Max) (mA)
VTM (Max) (V)
Static dV/dt (Min)
Commutating dV/dt (Min)
IH (Typ)
IDRM (Max)
VISO (Min)
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MOC3071M
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MOC3071SM
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MOC3071SR2VM
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MOC3071TVM
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可靠性数据
Die Related Summary Data
Device: MOC3071M
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)