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MC33153 专门设计为用于大功率应用的 IGBT 驱动器,包括电感电机控制、无电刷直流电机控制和不中断电源。尽管设计为驱动分立和模块 IGBT,但此器件提供了用于驱动功率 MOSFET 和双极晶体管的成本高效的方案。器件保护功能包括去饱和或过电流感应和欠电压检测。此类器件采用双列直插和表面贴装封装,包括以下功能:
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Power Switch
Number of Outputs
Topology
Isolation Type
Vin Max (V)
VCC Max (V)
Rise Time (ns)
Fall Time (ns)
Drive Source Current Typ (A)
Drive Sink Current Typ (A)
Turn On Prop. Delay Typ (ns)
Turn Off Prop. Delay Typ (ns)
Delay Matching
Reference Price
Last Shipments
Pb
A
H
P
SOIC-8
1
260
TUBE
98
N
IGBT
1
Single
Non-Isolated
20
20
17
17
1
2
80
120
-
Price N/A
More Details
MC33153DR2G
Active
Pb
A
H
P
SOIC-8
1
260
REEL
2500
Y
IGBT
1
Single
Non-Isolated
20
20
17
17
1
2
80
120
-
$0.897
More Details
MC33153PG
Active
Pb
A
H
P
PDIP-8
NA
0
TUBE
50
Y
IGBT
1
Single
Non-Isolated
20
20
17
17
1
2
80
120
-
$0.5297
More Details
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可靠性数据
Die Related Summary Data
Device: MC33153DG
Equivalent to wafer fab process: BP STD LINEAR
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BP STD LINEAR
10
12120914040
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)