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集成式负载开关
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这些集成的负载开关采用飞兆专有的、高单元密度DMOS技术生产。 这种密度非常高的工艺是专为最大限度地降低导通阻抗并保持卓越开关性能而定制的。 这些器件特别适合需要低传导损耗和轻松驱动的低压高边负载开关应用。
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CAD Models
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Over Current - Shutdown (Y/N)
Over Current - Current Source (Y/N)
Current Limit (FIXED/ADJ/NO)
Over Voltage Protection (Y/N)
Reverse Current Blocking (Y/N)
FAULT Signal (Y/N)
PGOOD (Y/N)
UVLO (Y/N)
Rds(on) Typ (mΩ)
Max Current (A)
Output Discharge (Y/N)
IMON Output (Y/N)
Adjustable Slew Rate (Y/N)
Vin Min (V)
Vin Max (V)
Iq (µA)
eFuse / Hot Plug (Y/N)
Input / Output
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Pb
A
H
P
TSOT-23-6
1
260
REEL
3000
N
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3
8
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Price N/A
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可靠性数据
Die Related Summary Data
Device: FDC6323L
Equivalent to wafer fab process: TP
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TP
8
738717284
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)