集成式负载开关

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概览

这些集成的负载开关采用飞兆专有的、高单元密度DMOS技术生产。 这种密度非常高的工艺是专为最大限度地降低导通阻抗并保持卓越开关性能而定制的。 这些器件特别适合需要低传导损耗和轻松驱动的低压高边负载开关应用。

  • This product is general usage and suitable for many different applications.
  • VDROP=0.2V @ VIN=5V,IL=1A,VON/OFF= 1.5V至8V
    VDROP=0.3V @ VIN=3.3V,IL=1A,VON/OFF= 1.5V至8V
  • 为极低导通电阻而设计的高单元密度
  • VON/OFF齐纳管可增强耐静电放电能力
    >6kV人体模型
  • SuperSOT™-6封装设计(使用铜引线框架),可提供出色的热和电气能力

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Over Current - Shutdown (Y/N)

Over Current - Current Source (Y/N)

Current Limit (FIXED/ADJ/NO)

Over Voltage Protection (Y/N)

Reverse Current Blocking (Y/N)

FAULT Signal (Y/N)

PGOOD (Y/N)

UVLO (Y/N)

Rds(on) Typ (mΩ)

Max Current (A)

Output Discharge (Y/N)

IMON Output (Y/N)

Adjustable Slew Rate (Y/N)

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Vin Max (V)

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eFuse / Hot Plug (Y/N)

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FDC6323L

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Last Shipments

CAD Model

Pb

A

H

P

TSOT-23-6

1

260

REEL

3000

N

-

-

-

-

-

-

-

-

-

-

-

-

-

3

8

-

-

-

-

Price N/A

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