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该器件特别适合为需要1.8V至8V输入以及2.5A输出电流能力的便携式电子设备提供紧凑型功率管理。 负载开关集成了一个小型N沟道功率MOSFET (Q1),在一个小型SuperSOT™-6封装中驱动一个大型P沟道功率MOSFET (Q2)。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Over Current - Shutdown (Y/N)
Over Current - Current Source (Y/N)
Current Limit (FIXED/ADJ/NO)
Over Voltage Protection (Y/N)
Reverse Current Blocking (Y/N)
FAULT Signal (Y/N)
PGOOD (Y/N)
UVLO (Y/N)
Rds(on) Typ (mΩ)
Max Current (A)
Output Discharge (Y/N)
IMON Output (Y/N)
Adjustable Slew Rate (Y/N)
Vin Min (V)
Vin Max (V)
Iq (µA)
eFuse / Hot Plug (Y/N)
Input / Output
Product Family
Reference Price
FDC6325L
Pb
A
H
P
TSOT-23-6
1
260
REEL
3000
N
-
-
-
-
-
-
-
-
-
-
-
-
-
2.5
8
-
-
-
-
Price N/A
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可靠性数据
Die Related Summary Data
Device: FDC6325L
Equivalent to wafer fab process: TP,TQ
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TP,TQ
8
632604834
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)