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双路运算放大器
Obsolete
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Rail to Rail
Channels
VS Min (V)
VS Max (V)
Iq Typ (mA)
VOS Max (mV)
GBW Typ (MHz)
SR Typ (V/µs)
IO Typ (mA)
ΔVOS/ΔT (μV/C)
eN (nV/√Hz)
Ibias Typ (pA)
CMRR Typ (dB)
Architecture
Temperature Range (°C)
Reference Price
Obsolete
Pb
A
H
P
SOIC-8
1
260
TUBE
8100
N
No
2
3
32
0.75
4
1
0.4
40
7
-
40000
85
Bipolar
-25 to 85
Price N/A
More Details
Obsolete
Pb
A
H
P
SOIC-8
1
260
REEL
3000
N
No
2
3
32
0.75
4
1
0.4
40
7
-
40000
85
Bipolar
-25 to 85
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: LM258AM
Equivalent to wafer fab process: 9
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
9
0
314834549
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)