MC12093 是一款单模预分频器,用于 1.1 GHz 高频输入信号的低功率分频。采用 MOSAIC V(tm) 技术,在 2.7 V 的最低供电电压下,实现 6.75 mW 的低功耗。片上输出端接提供输出电流来驱动一个 2.0 pF(典型值)高阻抗负载。如果需要额外的驱动器进行预分频器输出,可以从 OUT 引脚并行添加一个外部电阻到 GND,以增加输出功率。必须注意,通过输出的电流不得超过最大允许值。分频比控制输入 SW1 和 SW2 选择所需的分频比 2、4 或 8。采用待机模式,以当备用引脚 SB 切换为低电平禁用预分频器时,将电流损耗降低至 50 uA。
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MC12093DG
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MC12093DR2G
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MC12093MNR4G
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Die Related Summary Data
Device: MC12093DG
Equivalent to wafer fab process: MOSAIC
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平均故障间隔时间/平均无故障时间(按小时计算)
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MOSAIC
0
476668904
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)