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此驱动器和接收器对适用于使用低压差分信号 (LVDS) 技术的高速互联。该驱动器将 LVTTL 信号转换为 350mV 典型差分输出摆幅的 LVDS 电平,接收器则将 LVDS 信号转换为 100mV 典型差分输入阈值的 LVTTL 电平。即使在高频率下,LVDS 技术也提供低 EMI 和超低功耗。此器件适用于时钟或数据的高速传输。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Type
Channels
Input / Output Ratio
Input Level
Output Level
VCC Typ (V)
tJitterRMS Typ (ps)
tskew(o-o) Max (ps)
tpd Typ (ns)
tR & tF Max (ps)
fmaxClock Typ (MHz)
fmaxData Typ (Mbps)
Reference Price
FIN1019MTCX
Active
Pb
A
H
P
TSSOP-14 WB
1
260
REEL
2500
N
Signal Driver
2
1:1
LVDS
LVTTL
LVDS
LVTTL
3.3
-
-
-
-
-
-
$0.8139
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可靠性数据
Die Related Summary Data
Device: FIN1019MTCX
Equivalent to wafer fab process: CG
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CG
0
99833748
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)