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LE25S161 是一款 SPI 总线闪存器件,带有 16M 位(2048K × 8 位)配置。它使用单电源。LE25S161 尽管使得大多数功能均在串行闪存器件中内部提供,仍然采用了 8 引脚超微型封装。所有这些功能均使得此器件适用于便携信息设备等应用中的存储程序,在此类应用中,尺寸越来越紧凑。LE25S161 具有小扇区擦除能力,使得该器件适用于存储具有更少重写次数且传统 EEPROM 由于容量不足而无法处理的参数或信息。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Density
Organization
tACC Max (ns)
VCC Min (V)
VCC Max (V)
I(standby) Max (µA)
Iact Max (mA)
T Min (°C)
T Max (°C)
Reference Price
LE25S161XBTAG
Lifetime
Pb
A
H
P
WLCSP8 2.92x1.53x0.525
1
260
REEL
4000
N
16 Mb
2048 x 8
8
1.65
1.95
12
4.5
-40
90
$1.8266
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可靠性数据
Die Related Summary Data
Device: LE25S161XBTAG
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)