Flash Memory | LE25U40CMD

串行闪存，4 Mb (512K x 8)

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概览

LE25U40CMD 是一款 SPI 总线闪存器件，带有 4M 位（512K x 8 位）配置，由此增添了高性能的双输出和双 I/O 功能。它使用 2.5V 单电源。LE25U40CMD 充分利用串行闪存器件的内在特性，采用 8 引脚超小型封装。所有这些特性都使得此器件适用于存储便携信息设备等应用中的程序，在此类设备中，尺寸要求越来越紧凑。LE25U40CMD 还具有小扇区清除功能，因而使得该器件非常适合存储重写周期较少且传统 EEPROM 因空间不足而无法处理的参数或数据。

  • SPI Bus Flash Memory Devices

  • Portable Information Devices

  • Read/write operations enabled by single 2.5V power supply :
    2.3 to 3.6V supply voltage range
  • Operating frequency : 40MHz
  • Highly reliable read/write
    Number of rewrite times : 100,000 times
    Small sector erase time : 40ms (typ), 150ms (max)
    Sector erase time : 80ms (typ), 250ms (max)
    Chip erase time : 250ms (typ), 2.0s (max)
    Page program time : 4.0ms/256 bytes (typ), 5.0ms/256 bytes (max)
  • Data retention period : 20 years
  • Temperature range : -40 to 85°C
  • Serial interface :
    SPI mode 0, mode 3 supported / Dual Output, Dual I/O supported
  • Sector size : 4K bytes/small sector, 64K bytes/sector
  • Small sector erase, sector erase, chip erase functions
  • Page program function (256 bytes / page)
  • Block protect function
  • Status functions : Ready/busy information, protect information

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LE25U40CMDTWG

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Last Shipments

CAD Model

Pb

A

H

P

SOIC-8

751BD

2

260

REEL

2000

N

4 Mb

512k x 8

11

2.3

3.6

50

6

-40

85

Price N/A

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可靠性数据

Die Related Summary Data

Device: LE25U40CMDTWG

Equivalent to wafer fab process: ONC18

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

ONC18

2

6465777234

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Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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