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MC74AC646/74ACT646 由带输出的寄存总线收发器电路、 D 型触发器和控制电路组成,提供从输入总线或内部存储寄存器的多路复用数据传输。 A 或 B 总线上的数据将在相应时钟引脚(CAB 或 CBA)的低-高电平转换时加载到相应的寄存器中。 提供的四个基本数据处理功能 如下图所示。
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CAD Models
Compliance
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Case Outline
MSL Type
MSL Temp (°C)
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Container Qty.
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VCC Min (V)
VCC Max (V)
tpd Max (ns)
IO Max (mA)
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MC74ACT646DWG
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MC74ACT646DWR2G
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可靠性数据
Die Related Summary Data
Device: MC74ACT646DWG
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)