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高性能硅门极 CMOS MC74HC595A 包括一个 8 位移位寄存器和一个 8 位 D 形锁存,带三态并行输出。该移位寄存器接受串行数据,提供串行输出。该移位寄存器还向 8 位锁存提供并行数据。移位寄存器和锁存具有独立的时钟输入。此器件还具有用于移位寄存器的异步重置。HC595A 直接接口 CMOS MPU 和 MCU 上的 SPI 串行数据端口。
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MC74HC595ADG
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MC74HC595ADR2G
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MC74HC595ADR2G-Q
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MC74HC595ADTG
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MC74HC595ADTR2G
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MC74HC595ADTR2G-Q
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MC74HC595AMN1TWG-Q
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NLV74HC595ADG
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可靠性数据
Die Related Summary Data
Device: MC74HC595ADG
Equivalent to wafer fab process: CMOS SUB
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)