MM74HC595 高速移位寄存器采用先进的硅门极 CMOS 工艺制造。此器件具有标准 CMOS 集成电路的高抗扰性和低功耗,还具有驱动 15 个 LS-TTL 负载的能力。该器件包含一个 8 位串行输入并行输出移位寄存器,馈送 8 位 D 型存储寄存器。该存储寄存器具有八个 3 态输出。为移位寄存器和存储寄存器均提供单独的时钟。移位寄存器具有一个直接超控的清除串行输入,以及用于级联的多个串行输出(标准)引脚。移位寄存器和存储寄存器均使用正边触发时钟。如果两个时钟互相联接,移位寄存器状态则总是比存储寄存器提前一个时钟脉冲。74HC 逻辑系列与标准 74LS 逻辑系列在速度、功能和引脚输出方面均兼容。通过箝位到 VCC 和接地的内部二极管,可针对由于静电荷导致的损坏保护所有输入。
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MM74HC595M
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Die Related Summary Data
Device: MM74HC595M
Equivalent to wafer fab process: CMOS SUB
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平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)