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FXGL2014 是一款 4 沟道转换器,用于在 3.3-V LVTTL 芯片集 I/O 和 Xeon 处理器 GTL–/GTL/GTL+ I/O 之间进行接口。FXGL2014 在所有端子上均集成了 ESD 防护,采用 TSSOP 封装 (5.0 mm × 4.4 mm)。该器件的规格基于 -40°C 至 85°C 的自由空气温度范围。
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MSL Temp (°C)
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VCC Min (V)
VCC Max (V)
tpd Max (ns)
IO Max (mA)
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FXGL2014MTCX
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可靠性数据
Die Related Summary Data
Device: FXGL2014MTCX
Equivalent to wafer fab process: CF
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CF
0
371000342
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)