FXLP4555 是一款电平移位器模拟电路,适用于在 SIM 卡和外部基带之间转换电压。内置的 LDO 型 DC/DC 转换器使得 FXLP4555 可驱动 1.8V 和 3.0V SIM 卡。该器件符合 ISO7816-3 智能卡接口标准以及 GSM 11.11 (11.12 和 11.18)和 3G 移动要求(IMT-2000/3G UICC 标准)。EN 引脚实现了低电流关断模式,延长了电池寿命。该卡电源电压 (VCC_C) 使用单引脚 (VSEL) 选择。
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MSL Temp (°C)
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Input Level
VCCA Min (V)
VCCA Max (V)
VCCB Min (V)
VCCB Max (V)
IO Max (mA)
ICC Max (μA)
tpd Max (ns)
Data Rate (Mbps)
TA Min (°C)
TA Max (°C)
Reference Price
FXLP4555MPX
Active
Pb
A
H
P
WQFN-16
1
260
REEL
3000
Y
Special
1
CMOS
2.7
5.5
-
-
0.2
175000
n/a
-
-40
85
$0.1773
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可靠性数据
Die Related Summary Data
Device: FXLP4555MPX
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)