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MC14555B 和 MC14556B 采用互补 MOS (CMOS) 增强模型器件构建。每个解码器/信号分离器都具有两个选择输入(A 和 B)、一个有效低电平启用输入 (E) 和四个互斥输出(Q0、Q1、Q2、Q3)。MC14555B 让选定输出进入“高电平”状态,而 MC14556B 让选定输出进入“低电平”状态。通过使用其他 MC14555B 或 MC14556B 器件可以实现扩展解码,例如二进制到十六进制 (1/16)。应用包括数字数据传输系统中的代码转换、地址解码、内存选择控制和信号分离(使用启用输入作为数据输入)。
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tpd Max (ns)
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MC14555BDG
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MC14555BDR2G
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NLV14555BDR2G
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可靠性数据
Die Related Summary Data
Device: MC14555BDG
Equivalent to wafer fab process: CMOS STD
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS STD
3
3597164517
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)