Reliability Data - Device MTBF/MTTF/FIT

Device: NCP718BSN250T1G
Equivalent to wafer fab process: ONC25

Die Related Summary Data

产品技术

废品

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

ONC25

1

More Details

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

Disclaimer:
A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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