酚醛树脂(Phenolic Resin) [%]
|
Oxirane [%]
|
1,4-Bis(2,3-epoxypropoxy)butane [%]
|
Carbon Black (C) [%]
|
Fused Silica (SiO2) [%]
|
Silica Crystalline (SiO2) [%]
|
重量 [mg]
|
Bisphenol A_Epichlorohydrin Polymer [%]
|
Ethylene Glycol [%]
|
Sulfonium (Thiodi-4,1-phenylene) [%]
|
Modified Silicon Dioxide (SiO2) [%]
|
Formaldehyde Polymer [%]
|
重量 [mg]
|
Misc. [%]
|
Silicon (Si) [%]
|
Aluminum (Al) [%]
|
重量 [mg]
|
Gold (Au) [%]
|
重量 [mg]
|
Titanium Dioxide (TiO2) [%]
|
Sodium Monoxide (Na2O) [%]
|
Zinc Monoxide (ZnO) [%]
|
Antimony Trioxide (Sb2O3) [%]
|
Aluminum Trioxide (Al2O3) [%]
|
Potassium Monoxide (K2O) [%]
|
Silica Crystalline (SiO2) [%]
|
重量 [mg]
|
2-phenoxy ethyl acrylate [%]
|
Bisphenol A_Epichlorohydrin Polymer [%]
|
Epoxy Prepolymer [%]
|
Acrylate Oligomer [%]
|
Curative [%]
|
Formaldehyde Polymer [%]
|
重量 [mg]
|
Silver (Ag) [%]
|
Tin (Sn) [%]
|
Copper (Cu) [%]
|
重量 [mg]
|
Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane [%]
|
Fiber Glass (SiO2) [%]
|
Zinc (Zn) [%]
|
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2) [%]
|
Cyanic acid (1-methylethylidene)di-4,1-phenylene ester homopolymer [%]
|
Silica Amorphous (SiO2) [%]
|
Chromium (Cr) [%]
|
Acetophenone Derivative [%]
|
Carbon Black (C) [%]
|
2,4-Diethyl-9H-thioxanthen-9-one (DETX) [%]
|
Aluminum Hydroxide (Al(OH)3) [%]
|
Nickel (Ni) [%]
|
Gold (Au) [%]
|
Solvent Naphtha (Solvent oil) [%]
|
Formaldehyde Polymer [%]
|
Copper (Cu) [%]
|
Barium Sulfate (BaSO4) [%]
|
重量 [mg]
|
重量 [mg]
|