酚醛树脂(Phenolic Resin) [%]
|
Oxirane [%]
|
1,4-Bis(2,3-epoxypropoxy)butane [%]
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Carbon Black (C) [%]
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Fused Silica (SiO2) [%]
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Silica Crystalline (SiO2) [%]
|
重量 [mg]
|
2,2-bis(acryloyloxymethyl)butyl acrylate [%]
|
Imidazole Addition [%]
|
Epoxy Phenol Novolak Resin [%]
|
Silica (SiO2) [%]
|
重量 [mg]
|
Misc. [%]
|
Silicon (Si) [%]
|
Aluminum (Al) [%]
|
重量 [mg]
|
Gold (Au) [%]
|
重量 [mg]
|
Sulfur (S) [%]
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Titanium Dioxide (TiO2) [%]
|
Sodium Monoxide (Na2O) [%]
|
Boron Trioxide (B2O3) [%]
|
Zinc Monoxide (ZnO) [%]
|
Aluminum Trioxide (Al2O3) [%]
|
Potassium Monoxide (K2O) [%]
|
Silica Crystalline (SiO2) [%]
|
重量 [mg]
|
3,4-EPOXYCYCLOHEXYLMETHYL [%]
|
2,3-epoxypropyl-trimethoxysilan [%]
|
1,6-Bis(2,3-epoxypropoxy)naphthalene [%]
|
无机填充物 [%]
|
重量 [mg]
|
Fiber Glass (SiO2) [%]
|
无机填充物 [%]
|
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2) [%]
|
Silica Amorphous (SiO2) [%]
|
Acetophenone Derivative [%]
|
Carbon Black (C) [%]
|
2,4-Diethyl-9H-thioxanthen-9-one (DETX) [%]
|
Solvent Naphtha (Solvent oil) [%]
|
Copper (Cu) [%]
|
Barium Sulfate (BaSO4) [%]
|
重量 [mg]
|
重量 [mg]
|