feedback
评价本网页

需要帮助?

Reliability Data - Device MTBF/MTTF/FIT

Device: NSR0340V2T1G
Equivalent to wafer fab process: SSD

Die Related Summary Data

产品技术

废品

等效器件小时

平均故障间隔时间/平均无故障时间(按小时计算)

FITS

SSD 3

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

New Search
Help

Your request has been submitted for approval.
Please allow 2-5 business days for a response.
You will receive an email when your request is approved.
Request for this document already exists and is waiting for approval.