Vertical GaN
Leading the Charge
onsemi Powering the Next Leap Forward in AI and Electrification
A Breakthrough for AI and Electrification
onsemi’s vertical Gallium Nitride (vGaN) technology is a breakthrough power semiconductor technology that delivers record efficiency, power density, and ruggedness for the age of AI and electrification.
Developed and manufactured at the onsemi’s fab in Syracuse, NY, this next-generation “GaN-on-GaN” design moves current vertically through the chip instead of along the surface to enable far greater performance in a smaller, double-sided cooled package.
Featured Resources
Discover our most valuable vGaN resources handpicked to help you design smarter, faster, and with greater confidence.
Tutorial
Vertical GaN (VGaN) Overview
Brochure
Vertical GaN (VGaN) Fact Sheet
What is vGaN?
The novel next-generation GaN-on-GaN power semiconductors conduct current vertically, delivering record power density and efficiency, making it ideal for AI data centers, electric vehicles (EVs), renewable energy, and aerospace, defense and security.
onsemi vGaN Features
Higher Power Density
Up to 1,200 Volts and Beyond.
Efficiency Gains
Reduced energy loss and heat, increasing efficiency by up to 50%.
Compact Designs
Reduced end-system size and weight.
State-of-the-art Manufacturing
66,000 square-foot facility in Syracuse, NY. Proprietary processes grow GaN layers directly on GaN substrates.
Packaging Innovation
Double-sided cooled package.
Future-Proof
vGaN enables switching frequencies much higher than traditional solutions.
Key Technology Applications
Vertical GaN
AI Data Center
Increased power density for 800V DC-DC converters and reduced component counts to greatly improve cost per rack.
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Vertical GaN
Electric Vehicles
Smaller, lighter and more efficient inverters for increased EV range.
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Vertical GaN
Renewable Energy
Higher voltage handling and reduced energy losses for solar inverters. Fast, efficient, high-density power for energy storage systems.
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Vertical GaN
Aerospace, Defense, and Security
Higher performance, enhanced ruggedness, and more compact designs.
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