The rapid growth of Artificial Intelligence (AI) and cloud / edge computing is driving unprecedented data center expansion. With electricity costs as the largest operational expense, power conversion efficiency is critical for sustainability and cost reduction.
The growth of Artificial Intelligence (AI) has fueled data center expansion and the need for efficiency. Electricity is the biggest cost, making power conversion efficiency crucial. The demand for AI data center, cloud and edge computing, and connectivity requires higher rack power density and adapting to 800V HVDC architecture for megawatt AI infrastructure.
onsemi delivers intelligent power solutions spanning from the electrical grid to the GPU, enabling high‑density, energy‑efficient rack server architectures. By integrating EliteSiC™ MOSFETs and JFETs, PowerTrench® T10 MOSFETs, Gallium Nitride (GaN) HEMTs, point‑of‑load (PoL) buck regulators, smart fuses, and Vcore power solutions, system designers can achieve higher power density, improved efficiency, and precise power management across the entire server power chain.
These advanced power technologies help optimize energy consumption, reduce operational and cooling costs, and support the performance, reliability, and sustainability requirements of modern data center and AI server platforms.
Our SiC MOSFETs are designed to be fast and rugged and include system benefits from high efficiency to reduced system size and cost. MOSFETs are metal–oxide–semiconductor field-effect transistors with insulated gates. These silicon carbide MOSFETs have a higher blocking voltage and higher thermal conductivity than silicon MOSFETs, despite having similar design elements. SiC power devices also have a lower state resistance and 10 times the breakdown strength of regular silicon. In general, Systems with SiC MOSFETs have better performance and increased efficiency when compared to MOSFETs made with silicon material.
There are many advantages to choosing SiC MOSFETs over silicon MOSFETs, such as higher switching frequencies. High-temperature development is also not a concern when using SiC MOSFET modules because these devices can operate efficiently even in high heat. Additionally, with SiC MOSFETs, you benefit from a more compact product size because all components (inductors, filters, etc.) are smaller.
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