Reliability Data - Device MTBF/MTTF/FIT

Device: FAN5602MP5X
Equivalent to wafer fab process: 36

Die Related Summary Data

产品技术

废品

等效器件小时

平均故障间隔时间/平均无故障时间(按小时计算)

FITS

36 0

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

Disclaimer:
A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard), onsemi can calculate the raw FIT rate according to generic standards (IEC62380, IEC61709, SN29500, FIDES, etc.) or provide, when available, functional safety related documentation to allow for the integration of the components into the system. Support can be requested by sending an email to JIRA.GFSM@onsemi.com.

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