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安森美半导体的场截止 IGBT 采用新型场截止 IGBT 工艺,为太阳能逆变器、UPS、焊接机和 PFC 等低导通和开关损耗至关重要的应用。
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MSL Temp (°C)
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Family
V(BR)CES Typ (V)
IC Max (A)
VCE(sat) Typ (V)
VF Typ (V)
Eoff Typ (mJ)
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Irr Typ (A)
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Reference Price
FGH60N60SFDTU
Pb
A
H
P
TO-247-3
NA
0
TUBE
450
N
-
600
60
2.3
-
0.67
1.79
179
-
198
-
-
378
Yes
Price N/A
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可靠性数据
Die Related Summary Data
Device: FGH60N60SFDTU
Equivalent to wafer fab process: 3B,IM
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
3B,IM
0
975477967
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)