This Insulated Gate Bipolar Transistor (IGBT) features a robust andcost effective ultra Field Stop (FS) Trench construction and providessuperior performance. It is especially designed for low on−state and iswell suited for resonant or soft switching topologies, such as thoseused in inductive heating applications. The device contains a reverseconducting diode integrated on the same die, which makes the deviceconstruction very cost effective.
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V(BR)CES Typ (V)
IC Max (A)
VCE(sat) Typ (V)
VF Typ (V)
Eoff Typ (mJ)
Eon Typ (mJ)
Trr Typ (ns)
Irr Typ (A)
Gate Charge Typ (nC)
Short Circuit Withstand (µs)
EAS Typ (mJ)
PD Max (W)
Co-Packaged Diode
参考价格
已停产
Pb
A
H
P
TO-247-3
NA
0
TUBE
30
No
-
1400
30
1.95
2.1
1.05
~NA~
~NA~
~NA~
163
~NA~
~NA~
178
Yes
Price N/A
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可靠性数据
Die Related Summary Data
Device: NGTB30N140IHR3WG
Equivalent to wafer fab process: HVFET
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
HVFET
21
49137887952
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)