Small Signal MOSFETs | FDG6332C

20V N&P沟道Power Trench® MOSFET

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概览

这些N和P沟道MOSFET采用飞兆半导体先进的PowerTrench工艺生产，这一先进工艺是专为最大限度地降低通态电阻并保持卓越开关性能而定制的。这些器件经过专门设计，能以极小的尺寸提供极低的功耗，非常适合那些不宜采用更大更昂贵的TSSOP-8和SSOP-6封装的应用。

  • This product is general usage and suitable for many different applications.
  • Q1 0.7A, 20V. RDS(ON) = 300mΩ @ VGS = 4.5V RDS(ON) = 400mΩ @ VGS = 2.5V
  • Q2 -0.6A, -20V. RDS(ON) = 420mΩ @ VGS = -4.5V RDS(ON) = 630mΩ @ VGS = -2.5V
  • 低栅极电荷
  • 高性能沟道技术可实现极低的RDS(on)
  • SC70-60封装 小尺寸（比标准SSOT-6小51%）；薄型（1mm厚）。

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Case Outline

MSL Type

MSL Temp (°C)

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Container Qty.

ON Target

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Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

VGS Max (V)

Vgs(th) Max (V)

Id Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

参考价格

FDG6332C

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Last Shipments

CAD Model

Pb

A

H

P

SC-88-6 / SC-70-6 / SOT-363-6

419B-02

1

260

REEL

3000

No

Complementary

PowerTrench® T1

SC-6

Small Signal

Logic

0

Dual

0

±20

-

12

±1.5

N: 0.7, P: -0.6

0.3

N:400,P:630

N: 300, P: 420

1.1

1.4

114

-

-

-

-

Price N/A

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可靠性数据

Die Related Summary Data

Device: FDG6332C

Equivalent to wafer fab process: TT

产品技术

产品技术

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

TT

6

3566152280

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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