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此类双 P 沟道增强型场效应晶体管是使用安森美半导体的专属沟槽技术生产的。这种极高密度工艺可最大程度地降低导通电阻,提供了坚固可靠的性能和快速的开关。此产品尤其适用于需要低电流高压侧开关的低压应用。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Channel Polarity
Silicon Family
Package Name
Type
Gate Level
Wide SOA Mosfets
Configuration
OPN in older Technology
V(BR)DSS Min (V)
RDS(on) Max @ VGS = 10 V (mΩ)
VGS Max (V)
Vgs(th) Max (V)
Id Max (A)
PD Max (W)
RDS(on) Max @ VGS = 2.5 V (mΩ)
RDS(on) Max @ VGS = 4.5 V (mΩ)
Qg Typ @ VGS = 4.5 V (nC)
Qg Typ @ VGS = 10 V (nC)
Ciss Typ (pF)
Qgd Typ @ VGS = 4.5 V (nC)
Qrr Typ (nC)
Coss Typ (pF)
Crss Typ (pF)
Reference Price
NDC7003P
Active
Pb
A
H
P
TSOT-23-6
1
260
REEL
3000
N
P-Channel
PowerTrench® T1
SC-6
Small Signal
Logic
0
NA
0
-60
Q1=Q2=5000
±20
-3.5
-0.34
0.96
-
Q1=Q2=7000
-
1.6
66
0.3
-
13
6
$0.0819
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可靠性数据
Die Related Summary Data
Device: NDC7003P
Equivalent to wafer fab process: TR
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
TR
1
1603286882
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)