方案
By Technology
FODM611是一款5V高速逻辑门输出(开路集电极)光电耦合器,支持隔离式通信,允许数字信号在不传导接地环路或危险电压的情况下在系统间通信。 该器件采用飞兆专有的共面封装技术,Optoplanar®,优化了IC设计,通过高共模瞬变抑制规格特点实现了高抗噪能力。 该光电耦合器在输入端包括一个AlGaAS LED,该LED光耦合至一个高速集成光电检测器逻辑门。 检测器IC输出是一个开路集电极肖特基箝位晶体管。 在-40°C至+85°C温度范围内可确保耦合参数。 5mA的最大输入信号将提供13mA的最小输出灌电流(扇出为8)。
如需购买产品或样品,请先登录您的安森美账号。
搜寻
Close Search
产品:
2
分享
排序方式
产品系列:
┗
可订购器件:
2
产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Data Rate (Mbps)
VCC (Max) (V)
VCC (Min) (V)
Channels
IFT (Max) (mA)
VOL (Max) (V)
ICCL (Max) (mA)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Max) (kV/µs)
VISO (Min) (V)
TOPR (Min) (°C)
TOPR (Max) (°C)
Reference Price
FODM611
Active
Pb
A
H
P
MFP-5
1
260
TUBE
3000
Y
10
5.5
4.5
1
5
0.6
10
100
100
35
20
3750
-40
85
$0.5981
More Details
FODM611R2
Active
Pb
A
H
P
MFP-5
1
260
REEL
2500
Y
10
5.5
4.5
1
5
0.6
10
100
100
35
20
3750
-40
85
$0.4269
More Details
Show More
1-25 of 25
Products per page
Jump to :
Find and compare products, get support and connect with onsemi sales team.
Contact Sales
分享
导出
Rows
Printer Friendly Version
PDF Format
Excel Format
CSV Format
To proceed order you need to accept Terms
可靠性数据
Die Related Summary Data
Device: FODM611
Equivalent to wafer fab process: BN,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BN,GA
0
252701301
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)