TRIAC Driver Optocouplers | FODM3063

600V 5mA 零交叉三端双向可控硅，MFP

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概览

FODM306X 和 FODM308X 包含一个红外发光二极管，该二极管与执行零电压交叉双侧三端双向可控硅驱动器功能的单片硅检测器进行光耦合并采用紧凑型 4 引脚微型扁平封装。引线间距为 2.54mm。此类器件适用于从 115/240V 交流线路供电设备逻辑系统接口中的三端双向可控硅开关元件，如固态继电器、工业控制、电机、电磁阀和消费品设备等。

  • 消费型设备
  • 工业级电机

  • dv/dt保证值为600V/µs
  • 紧凑的4引脚表面帖装封装（2.4mm最大离板高度）
  • 电压过零检测
  • 峰值闭塞电压： 600V (FODM306X) 800V (FODM308X)
  • 可以卷带和卷盘形式提供，数量2500。
  • C-UL、UL和VDE认证（待审批）

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VDRM (Min) (V)

IFT (Max) (mA)

VTM (Max) (V)

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Commutating dV/dt (Min)

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IDRM (Max)

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FODM3063

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CAD Model

Pb

A

H

P

MFP-4

100AP

1

260

TUBE

3000

N

600

5

3

600

-

300

500

3750

$0.3315

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FODM3063R2

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CAD Model

Pb

A

H

P

MFP-4

100AP

1

260

REEL

2500

N

600

5

3

600

-

300

500

3750

$0.6829

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可靠性数据

Die Related Summary Data

Device: FODM3063

Equivalent to wafer fab process: BN,GA

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

BN,GA

0

252701301

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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