集成式负载开关

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概览

这些集成式负载开关是使用安森美半导体专有的高单元密度 DMOS 技术生产的。这种极高密度工艺特别适用于最大程度降低导通电阻,可提供卓越的开关性能。此类器件特别适用于需要低导通损耗和简单驱动的低电压高压侧负载开关应用。

  • This product is general usage and suitable for many different applications.

  • VDROP=0.2V @ VIN=12V,IL=1A,VON/OFF= 1.5V至8V
    VDROP=0.3V @ VIN=5V,IL=1A,VON/OFF= 1.5V至8V
  • 为极低导通电阻而设计的高单元密度
  • VON/OFF齐纳二极管保护可增强耐静电放电能力
    >6kV人体模型
  • SuperSOT™-6封装设计(使用铜引线框架),可提供出色的热和电气能力

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状态

CAD Models

Compliance

Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Over Current - Shutdown (Y/N)

Over Current - Current Source (Y/N)

Current Limit (FIXED/ADJ/NO)

Over Voltage Protection (Y/N)

Reverse Current Blocking (Y/N)

FAULT Signal (Y/N)

PGOOD (Y/N)

UVLO (Y/N)

Rds(on) Typ (mΩ)

Max Current (A)

Output Discharge (Y/N)

IMON Output (Y/N)

Adjustable Slew Rate (Y/N)

Vin Min (V)

Vin Max (V)

Iq (µA)

eFuse / Hot Plug (Y/N)

Input / Output

Product Family

Reference Price

Active

CAD Model

Pb

A

H

P

TSOT-23-6

1

260

REEL

3000

Y

-

-

-

-

-

-

-

-

-

-

-

-

-

3

20

-

-

-

-

$0.2316

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