Silicon Photomultipliers (SiPM) | C-SERIES

硅光电倍增传感器，C 系列 (SiPM)

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安森美半导体的 C 系列硅光电倍增 (SiPM) 传感器具有行业领先的 30 kHz/mm2 低暗计数率，以及卓越的 ±250 mV 击穿电压均匀性。高光子探测效率 (PDE) 使用大容量 CMOS 工艺延伸到了光谱蓝色部分。 C 系列传感器提供 1 mm、3 mm 和 6 mm 尺寸以及多种微单元尺寸。此类器件封装在可平铺成型引线框架 (MLP) 封装内，可兼容行业标准、无引线、回流焊接工艺。C 系列还具有独特的快速输出，适用于快速计时应用。

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • Industrial LiDAR
  • Biophotonic systems
  • Glucose monitors
  • Radiation Monitoring

  • >40% PDE at 420 nm, and extended sensitivity to 300 nm for improved UV sensitivity
  • Ultra-low dark count rates of 30 kHz/mm2
  • Exceptional breakdown voltage uniformity of ±250 mV over all C-Series products
  • Temperature stability of 21.5 mV/°C
  • Ultra-fast rise times of 300 ps with 600 ps pulse width from a unique ‘fast output’ terminal
  • Bias voltage of <30 V
  • 1 mm, 3 mm, and 6 mm sensor sizes

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MICROFC-10010-SMT-TR

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CAD Model

Pb

A

H

P

CWDFN-4

512AK

3

260

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3000

Y

Single

~NA~

1 mm x 1 mm

10

420

18

30

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MICROFC-10010-SMT-TR1

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Pb

A

H

P

CWDFN-4

512AK

4

260

REEL

1

Y

Single

~NA~

1 mm x 1 mm

10

420

18

30

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MICROFC-10020-SMT-TR

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Pb

A

H

P

CWDFN-4

512AK

3

260

REEL

3000

Y

Single

~NA~

1 mm x 1 mm

20

420

31

30

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MICROFC-10020-SMT-TR1

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Pb

A

H

P

CWDFN-4

512AK

4

260

REEL

1

Y

Single

~NA~

1 mm x 1 mm

20

420

31

30

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MICROFC-10035-SMT-TR

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Pb

A

H

P

CWDFN-4

512AK

3

260

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3000

Y

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1 mm x 1 mm

35

420

41

30

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MICROFC-10035-SMT-TR1

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Pb

A

H

P

CWDFN-4

512AK

4

260

REEL

1

Y

Single

~NA~

1 mm x 1 mm

35

420

41

30

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MICROFC-30020-SMT-TR

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Pb

A

H

P

CWDFN-4

512AH

3

260

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3000

Y

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3 mm x 3 mm

20

420

31

30

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MICROFC-30020-SMT-TR1

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Pb

A

H

P

CWDFN-4

512AH

4

260

REEL

1

Y

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~NA~

3 mm x 3 mm

20

420

31

30

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MICROFC-30035-SMT-TR

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Pb

A

H

P

CWDFN-4

512AF

3

260

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3000

Y

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3 mm x 3 mm

35

420

41

30

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MICROFC-30035-SMT-TR1

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Pb

A

H

P

CWDFN-4

512AF

4

260

REEL

1

Y

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~NA~

3 mm x 3 mm

35

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41

30

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MICROFC-30050-SMT-TR

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512AH

3

260

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3000

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3 mm x 3 mm

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47

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MICROFC-30050-SMT-TR1

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CAD Model

Pb

A

H

P

CWDFN-4

512AH

4

260

REEL

1

Y

Single

~NA~

3 mm x 3 mm

50

420

47

30

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MICROFC-60035-SMT-TR

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Pb

A

H

P

CWDFN-4

512AG

3

260

REEL

3000

Y

Single

~NA~

6 mm x 6 mm

35

420

41

30

Price N/A

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MICROFC-60035-SMT-TR1

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Active

CAD Model

Pb

A

H

P

CWDFN-4

512AG

4

260

REEL

1

Y

Single

~NA~

6 mm x 6 mm

35

420

41

30

Price N/A

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可靠性数据

Die Related Summary Data

Device: MICROFC-30035-SMT-TR

Equivalent to wafer fab process: CMOS SUB

产品技术

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

CMOS SUB

2

920154574

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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