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安森美半导体的 J 系列硅光电倍增传感器 (SiPM) 针对高性能计时应用进行了优化,如 ToF-PET(飞行时间正电子发射层析成像)。由于提高了微单元密度,J 系列传感器可以实现 50% 的光电检测效率 (PDE),灵敏度可扩展到紫外线。该系列具有行业领先的低低暗计数率 50 kHz/mm2,并且因为此类传感器是使用大容量 CMOS 硅工艺生产的,所以它们具有 ±250 mV 的卓越中断电压一致性。 J 系列提供在 TSV 芯片级封装中封装的 3 mm、4 mm 和 6 mm 尺寸,符合行业标准的无铅回流焊接工艺。J 系列还具有安森美半导体独特的快速输出,适用于快速计时功能。
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MICROFJ-30020-TSV-TR
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MICROFJ-30020-TSV-TR1
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MICROFJ-30035-TSV-TR
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MICROFJ-30035-TSV-TR1
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MICROFJ-40035-TSV-TR
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MICROFJ-40035-TSV-TR1
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MICROFJ-60035-TSV-TR
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MICROFJ-60035-TSV-TR1
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可靠性数据
Die Related Summary Data
Device: MICROFJ-30020-TSV-TR
Equivalent to wafer fab process: CMOS SUB
产品技术
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)