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LE25U20AFD 是一款可兼容串行接口的闪存器件,带有 256K × 8 位配置。它使用 2.5 V 单电源。在充分利用串行闪存设备固有特性的同时,LE25U20AFD 采用 8 引脚超小型封装。这些功能均使得此器件适用于便携信息设备等应用中的存储程序代码,在此类应用中,尺寸越来越紧凑。而且,通过使用小扇区擦除功能,此产品还适用于参数和日期存储用途,并且具有相对较小的重写时间,而这点是 EEPROM 的能力短板。
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Compliance
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Case Outline
MSL Type
MSL Temp (°C)
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tACC Max (ns)
VCC Min (V)
VCC Max (V)
I(standby) Max (µA)
Iact Max (mA)
T Min (°C)
T Max (°C)
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LE25U20AFD-AH
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可靠性数据
Die Related Summary Data
Device: LE25U20AFD-AH
Equivalent to wafer fab process: ONC18
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
ONC18
2
6465777234
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)