封装图纸

封装图纸 用于  Audio Power Amplifiers (显示所有)

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Document Title
Document ID/Size
Revision
Revision Date
1.45X1.45X0.6MM-0.5MM PIT 499E (43kB) A Oct, 2019
12-Pin Flip-Chip, 2x1.5, 0.5P 499AZ (46kB) O May, 2019
12PIN FLIP-CHIP, 1.62X1.22 499BJ (45kB) C Jun, 2019
20 LEAD PDIP 738-03 (43kB) E Dec, 2019
20 Pin Flip-Chip, 2.5x2 499BH (49kB) A May, 2019
9 Pin Flip-Chip, 1.45 x 1.45 mm 499AL (43kB) O May, 2019
C/O FOR MICRO 10 PKG 846B (30.6kB) D
DFN10, 3x3, 0.5P 485C (49kB) E Nov, 2019
DFN8 3x3, 0.5P 506BJ (43kB) O Nov, 2019
Micro8 Surface Mount 846A-02 (56kB) K Jul, 2020
PDIP-16 648-08 (50kB) V Nov, 2019
QFN32, 5x5, 0.5P, 3.1x3.1EP 488AM (46kB) A Nov, 2019
SIP10 44x25.6 127BH (37kB) O Nov, 2019
SIP15 47x25.6 127BC (38kB) O Dec, 2019
SOIC-16 WB 751G-03 (68kB) E
SOIC-20 WB 751D-05 (51kB) H Nov, 2019
SOIC-8 Narrow Body 751-07 (53kB) AK Oct, 2019
TSSOP 20 LEAD 9.48 (52kB) D Nov, 2019
TSSOP-14 WB 948G-01 (51kB) C Nov, 2019
TSSOP-16 948F-01 (52kB) B Nov, 2019
UDFN10 3x3, 0.5P 506AT (45kB) A Nov, 2019
UDFN16 3.2x2.4, 0.4P 517AL (33.2kB) O
UDFN8 2x2.2, 0.5P 506AV (42kB) C May, 2019
WLCSP12 1.86x1.44x0.586 567QB (125kB) O Nov, 2019
WLCSP30 2.89x2.31x0.586 567VB (65.8kB) O Jul, 2019
WLCSP6 1.242x0.842x0.457 567TS (149.7kB) A
WLCSP9, 1.22X1.22 499BM (42kB) O Dec, 2019
WQFN12, 3x3, 0.5P 510AH (58.5kB) O
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