封装图纸 用于  Audio Power Amplifiers (显示所有)

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Document Title
Document ID/Size
Revision Date
1.45X1.45X0.6MM-0.5MM PIT 499E (43kB) A Oct, 2019
12-Pin Flip-Chip, 2x1.5, 0.5P 499AZ (46kB) O May, 2019
12PIN FLIP-CHIP, 1.62X1.22 499BJ (45kB) C Jun, 2019
20 LEAD PDIP 738-03 (43kB) E Dec, 2019
20 Pin Flip-Chip, 2.5x2 499BH (49kB) A May, 2019
9 Pin Flip-Chip, 1.45 x 1.45 mm 499AL (43kB) O May, 2019
C/O FOR MICRO 10 PKG 846B (30.6kB) D
DFN10, 3x3, 0.5P 485C (49kB) E Nov, 2019
DFN8 3x3, 0.5P 506BJ (43kB) O Nov, 2019
HMSOP8 (150mil) 846AF (38kB) O Nov, 2019
HSSOP13 (225 mil) 5.2x4.4, 0.65P 944AD (39kB) O Dec, 2019
HSSOP14 (225mil) 944AA (46kB) A Nov, 2019
HSSOP36 (275 mil) 943AH (55kB) A Dec, 2019
HZIP25 945AD (54kB) A Nov, 2019
MSOP 8, 3x3 846AD (40kB) revo Nov, 2019
Micro8 Surface Mount 846A-02 (56kB) K Jul, 2020
PDIP-16 648-08 (50kB) V Nov, 2019
QFN32, 5x5, 0.5P, 3.1x3.1EP 488AM (46kB) A Nov, 2019
SIP10 44x25.6 127BH (37kB) O Nov, 2019
SIP12 26.8x11.8 / SIP12H 127AM (45kB) A Dec, 2019
SIP14 36.8x13.8 / SIP14H 127AQ (44kB) A Nov, 2019
SIP14 36x13.8 / SIP14HD 127DB (48kB) A Dec, 2019
SIP15 47x25.6 127BC (38kB) O Dec, 2019
SIP5 9.5x11.8 / SIP5H 127AF (36kB) O Nov, 2019
SO-16 WB 751G-03 (47kB) D Nov, 2019
SOIC-20 WB 751D-05 (51kB) H Nov, 2019
SOIC-8 Narrow Body 751-07 (53kB) AK Oct, 2019
SOIC8 W / MFP8 (225 mil) 751BV (37kB) O Dec, 2019
SSOP20 (225mil) 565AN (44kB) A Nov, 2019
SSOP44J (275mil) Exposed Pad 940AG (55kB) A Nov, 2019
TSSOP 20 LEAD 9.48 (52kB) D Nov, 2019
TSSOP-14 WB 948G-01 (51kB) C Nov, 2019
TSSOP-16 948F-01 (52kB) B Nov, 2019
TSSOP30 5.6x9.75 / TSSOP30 (275 mil) 948BB (48kB) A Nov, 2019
UDFN10 3x3, 0.5P 506AT (45kB) A Nov, 2019
UDFN16 3.2x2.4, 0.4P 517AL (33.2kB) O
UDFN8 2x2.2, 0.5P 506AV (42kB) C May, 2019
WLCSP12 1.86x1.44x0.586 567QB (125kB) O Nov, 2019
WLCSP30 2.89x2.31x0.586 567VB (65.8kB) O Jul, 2019
WLCSP6 1.242x0.842x0.457 567TS (149.7kB) A
WLCSP9, 1.22X1.22 499BM (42kB) O Dec, 2019
WQFN12, 3x3, 0.5P 510AH (58.5kB) O
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