Reliability Data - Device MTBF/MTTF/FIT

Device: FD3501MNTXG
Equivalent to wafer fab process: ONC18

Die Related Summary Data

产品技术

废品

等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

ONC18

2

More Details

Data is based on the following assumptions:

Activation Energy (constant) 0.7 electron-volts
Junction Temperature (25 - 175) Celsius
One-sided Upper Confidence Level percent

Note: The temperature and confidence level may be adjusted to your requirements.
Click the 'Calculate' button when set.

Disclaimer:
A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

New Search
Help
Your request has been submitted for approval.
Please allow 2-5 business days for a response.
You will receive an email when your request is approved.
Request for this document already exists and is waiting for approval.