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安森美推出采用创新Top Cool封装的MOSFET
November 15, 2022
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Top-side cooling simplifies design and reduces cost for compact power solutions
MUNICH – Nov. 15, 2022 – onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced a series of new MOSFET devices that feature innovative top-side cooling to assist designers in challenging automotive applications, especially within motor control and DC/DC conversion. The company is showing the new devices at its booth 101 in hall C4 at electronica, the world’s leading trade fair and conference for electronics.
Housed in a TCPAK57 package measuring just 5mm x 7mm, the new Top Cool devices feature a 16.5mm2 thermal pad on the top side. This allows heat to be dissipated directly into a heatsink rather than via a typical printed circuit board (PCB). By enabling the use of both sides of the PCB and decreasing the amount of heat going into it, the TCPAK57 provides increased power density. Improved reliability of the new design adds to an overall extended system lifetime.
“Cooling is one of the greatest challenges in high power design and successfully addressing it is the key enabler to reducing size and weight, which is critical in modern automotive design,” said Fabio Necco, vice president and general manager, Automotive Power Solutions at onsemi. “With excellent electrical efficiency and having eliminated the PCB from the thermal path, the design is significantly simplified while reducing size and cost.”
The devices deliver the electrical efficiency required in high power applications with RDS(ON) values as low as 1mΩ. Additionally, the gate charge (Qg) is low (65 nC), reducing losses in high-speed switching applications.
This solution leverages onsemi’s deep expertise in packaging to provide the highest power density solution in the industry. TCPAK57 initial portfolio includes 40V, 60V and 80V. All devices are capable of operating at junction temperatures (Tj) of 175°C and are AEC-Q101 qualified and PPAP capable. This, along with their gull wings that allows inspection of solder joints and superior board level reliability, makes them ideally suited to demanding automotive applications. The target applications are high/medium power motor controls such as electric power steering and oil pumps.
Samples of the new devices are available now with full-scale manufacture planned in January 2023. Please contact our sales office.
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关于安森美（onsemi）
安森美（onsemi, 纳斯达克股票代号：ON）致力推动颠覆性创新，打造更美好的未来。公司关注汽车和工业终端市场的大趋势，加速推动汽车功能电子化和汽车安全、可持续电网、工业自动化以及5G和云基础设施等细分领域的变革创新。安森美提供高度差异化的创新产品组合以及智能电源和智能感知技术，以解决全球最复杂的挑战，引领创造更安全、更清洁、更智能的世界。安森美位列《财富》美国500强，也被纳入纳斯达克100指数和标普500指数。了解更多关于安森美的信息，请访问：www.onsemi.cn。
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