该 1200V NPT IGBT 采用安森美半导体的专属沟槽设计和先进 NPT 技术,提供卓越导通和开关性能、高雪崩耐用性和轻松并联操作。该器件非常适合谐振或软开关应用,比如电感加热、微波炉
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可靠性数据
Die Related Summary Data
Device: FGA15N120ANTDTU-F109
Equivalent to wafer fab process: 3B,IK
产品技术
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
3B,IK
0
1413516796
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)