Small Signal MOSFETs | FDC8878

N 沟道 PowerTrench® MOSFET，30 V，8.0 A，16 mΩ

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概览

此 N 沟道 MOSFET 是使用先进的 Power Trench® 工艺生产的，针对 rDS(on)、开关性能进行了优化。

  • 笔记本电脑

  • VGS = 10V，ID = 8.0 A时，最大rDS(on) = 16mΩ
  • VGS = 4.5V，ID = 7.5 A时，最大rDS(on) = 18mΩ
  • 高性能沟道技术可实现极低的rDS(on)
  • 快速开关速度
  • 符合RoHS标准

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Package Type

Case Outline

MSL Type

MSL Temp (°C)

Container Type

Container Qty.

ON Target

Channel Polarity

Silicon Family

Package Name

Type

Gate Level

Wide SOA Mosfets

Configuration

OPN in older Technology

V(BR)DSS Min (V)

RDS(on) Max @ VGS = 10 V (mΩ)

VGS Max (V)

Vgs(th) Max (V)

Id Max (A)

PD Max (W)

RDS(on) Max @ VGS = 2.5 V (mΩ)

RDS(on) Max @ VGS = 4.5 V (mΩ)

Qg Typ @ VGS = 4.5 V (nC)

Qg Typ @ VGS = 10 V (nC)

Ciss Typ (pF)

Qgd Typ @ VGS = 4.5 V (nC)

Qrr Typ (nC)

Coss Typ (pF)

Crss Typ (pF)

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FDC8878

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CAD Model

Pb

A

H

P

TSOT-23-6

419BL

1

260

REEL

3000

Y

N-Channel

PowerTrench® T1

SC-6

Small Signal

Logic

0

Single

0

30

16

20

3

8

1.6

-

18

2.5

6

782

-

-

-

-

$0.4139

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可靠性数据

Die Related Summary Data

Device: FDC8878

Equivalent to wafer fab process: RN

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RN

9

5181260142

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Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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