6 A,200 V,平面 Ultrafast 整流器,LFPAK 封装

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此 LFPAK Ultrafast 整流器提供了快速开关性能,带软恢复,采用紧凑型热高效封装。LFPAK 封装提供了 DPAK 的绝佳替代品,两者具有同样优秀的热性能,而板空间只有后者的一半以下。其小外形使其成为平板显示屏和垂直间隙有限的其他应用的优秀选项。该器件提供随时间的低漏电流,适用于需要低静止电流的应用。

  • Case: Epoxy, Molded
  • • Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
  • Lead Finish: 100% Matte Sn (Tin)
  • Lead and Mounting Surface Temperature for Soldering Purposes:260°C Max. for 10 Seconds
  • Device Meets MSL 1 Requirements

  • New Package Provides Capability of Inspection and Probe AfterBoard Mounting
  • Low Forward Voltage Drop
  • 175°C Operating Junction Temperature
  • Excellent Ability to Absorb Stresses Associated with PowerTemperature Cycling
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

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Package Type

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MSL Type

MSL Temp (°C)

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IO(rec) Max (A)

trr Max (ns)

VRRM Max (V)

VFM Max (V)

IFSM Max (A)

IR Max (mA)

Reference Price

NHP620LFST1G

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CAD Model

Pb

A

H

P

LFPAK-4

1

260

REEL

3000

Y

-

6

50

200v

0.95

150

5.0E-7

$0.5401

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