Rectifiers | NHP620LFS

6 A，200 V，平面 Ultrafast 整流器，LFPAK 封装

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此 LFPAK Ultrafast 整流器提供了快速开关性能，带软恢复，采用紧凑型热高效封装。LFPAK 封装提供了 DPAK 的绝佳替代品，两者具有同样优秀的热性能，而板空间只有后者的一半以下。其小外形使其成为平板显示屏和垂直间隙有限的其他应用的优秀选项。该器件提供随时间的低漏电流，适用于需要低静止电流的应用。

  • Case: Epoxy, Molded
  • • Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
  • Lead Finish: 100% Matte Sn (Tin)
  • Lead and Mounting Surface Temperature for Soldering Purposes:260°C Max. for 10 Seconds
  • Device Meets MSL 1 Requirements

  • New Package Provides Capability of Inspection and Probe AfterBoard Mounting
  • Low Forward Voltage Drop
  • 175°C Operating Junction Temperature
  • Excellent Ability to Absorb Stresses Associated with PowerTemperature Cycling
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHSCompliant

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NHP620LFST1G

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CAD Model

Pb

A

H

P

LFPAK-4

760AB

1

260

REEL

3000

Y

-

6

50

200v

0.95

150

5.0E-7

$0.5401

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可靠性数据

Die Related Summary Data

Device: NHP620LFST1G

Equivalent to wafer fab process: RECT

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等效器件小时

平均故障间隔时间/平均无故障时间（按小时计算）

FITS

RECT

3

19108175705

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Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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