200 mA, 30 V, Schottky Barrier Diode

概览

The Schottky diode is optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon no lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100 percent utilization of the package area for active silicon offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.

  • LCD and Keypad Backlighting
  • Camera Photo Flash
  • Buck and Boost DC-DC Converters
  • Reverse Voltage and Current Protection
  • Mobile Handsets
  • Notebooks, PCs & PDA
  • GPS, MP3 Players
  • Low Forward Voltage Drop
  • High Switching Speed
  • Low Reverse Current
  • High ESD Rating

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VRRM Min (V)

VF Max (V)

IRM Max (µA)

IO(rec) Max (A)

IFSM Max (A)

trr Max (ns)

Cj Max (pF)

Package Size (mm)

参考价格

NSR02F30NXT5G

量产中

CAD Model

Pb

A

H

P

DSN-2

1

260

DSFTP

5000

Yes

Single

30

0.37

7

0.2

4

-

7

0.60 x 0.30 x 0.27

$0.0679

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