FDMF3172 是安森美半导体的下一代智能功率级 (SPS) 方案,带有全面优化的、超紧凑型集成 MOSFET,还带有先进的驱动器集成电路电流和温度传感器,用于高电流、高频率和同步降压 DC-DC 转换器。 该 SPS 开关功率级采用集成方式,针对驱动器和 MOSFET 动态性能、系统寄生抑制和功率 MOSFET RDS(ON) 进行优化。 功率 MOSFET 与驱动器集成电路的集成实现了高精度模块级电流和温度监控。FDMF3172 提供输出信号 (IMON),报告实时模块电流。IMON 信号可用于替换电感器 DCR 电流传感或电阻传感方法。还有非常精确的温度监控 (TMON),在 25°C 下以 8 mV / °C 斜率提供 0.8V 输出。
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FDMF3172
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Device: FDMF3172
Equivalent to wafer fab process: 29,RN
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29,RN
0
129145414
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)