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J 系列 SiPM 传感器的高填充系数阵列: 安森美半导体的 J 系列硅光电倍增 (SiPM) 传感器用于生产高填充系数、可扩展阵列。TSV 封装的传感器安装在 PCB 板上,死区空间很少。该 ArrayJ 产品提供多种格式,由 3 mm、4 mm 或 6 mm 像素组成。每个 ArrayJ 的背部都有一个或多个多路接头或 BGA(球形焊点阵列),可用于访问每个像素标准输出,在某些情况下还可以访问快速输出。
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可订购器件:
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CAD Models
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Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Type
Array Format
Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
Reference Price
ARRAYJ-30020-16P-PCB
Active
Pb
A
H
P
ARRAYJ-300XX-16P-PCB
1
260
UNTBX
1
Y
Array
4 x 4
3 mm x 3 mm
20
420
38
50
Price N/A
More Details
ARRAYJ-30020-64P-PCB
Active
Pb
A
H
P
ARRAYJ-300XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
3 mm x 3 mm
20
420
38
50
Price N/A
More Details
ARRAYJ-30035-16P-PCB
Active
Pb
A
H
P
ARRAYJ-300XX-16P-PCB
1
260
UNTBX
1
Y
Array
4 x 4
3 mm x 3 mm
35
420
50
50
Price N/A
More Details
ARRAYJ-30035-64P-PCB
Active
Pb
A
H
P
ARRAYJ-300XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
3 mm x 3 mm
35
420
50
50
Price N/A
More Details
ARRAYJ-40035-64P-PCB
Active
Pb
A
H
P
ARRAYJ-400XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
4 mm x 4 mm
35
420
50
50
Price N/A
More Details
ARRAYJ-60035-4P-BGA
Active
Pb
A
H
P
ARRAYJ-600XX-4P
1
260
UNTBX
1
Y
Array
2 x 2
6 mm x 6 mm
35
420
50
50
Price N/A
More Details
ARRAYJ-60035-4P-PCB
Active
Pb
A
H
P
ARRAYJ-600XX-4P-PCB
1
260
UNTBX
1
Y
Array
2 x 2
6 mm x 6 mm
35
420
50
50
Price N/A
More Details
ARRAYJ-60035-64P-PCB
Active
Pb
A
H
P
ARRAYJ-600XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
6 mm x 6 mm
35
420
50
50
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: ARRAYJ-30020-16P-PCB
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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