硅光电倍增阵列,J 系列 (SiPM)

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J 系列 SiPM 传感器的高填充系数阵列: 安森美半导体的 J 系列硅光电倍增 (SiPM) 传感器用于生产高填充系数、可扩展阵列。TSV 封装的传感器安装在 PCB 板上,死区空间很少。该 ArrayJ 产品提供多种格式,由 3 mm、4 mm 或 6 mm 像素组成。每个 ArrayJ 的背部都有一个或多个多路接头或 BGA(球形焊点阵列),可用于访问每个像素标准输出,在某些情况下还可以访问快速输出。

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • High fill-factor, scalable arrays
  • Variety of formats ranging from 2×2 to 8×8
  • Minimal deadspace, with fill factors of >90%
  • Each array as either a multi-way connector or BGA on the reverse for access to all signals
  • The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor
  • The pixel-level performance is exactly as per that of the individual J-Series sensors
  • Optional evaluation boards are available for easy access to signals

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ARRAYJ-30020-16P-PCB

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CAD Model

Pb

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ARRAYJ-300XX-16P-PCB

1

260

UNTBX

1

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Array

4 x 4

3 mm x 3 mm

20

420

38

50

Price N/A

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ARRAYJ-30020-64P-PCB

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CAD Model

Pb

A

H

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ARRAYJ-300XX-64P-PCB

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

20

420

38

50

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ARRAYJ-30035-16P-PCB

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CAD Model

Pb

A

H

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ARRAYJ-300XX-16P-PCB

1

260

UNTBX

1

Y

Array

4 x 4

3 mm x 3 mm

35

420

50

50

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ARRAYJ-30035-64P-PCB

Active

CAD Model

Pb

A

H

P

ARRAYJ-300XX-64P-PCB

1

260

UNTBX

1

Y

Array

8 x 8

3 mm x 3 mm

35

420

50

50

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ARRAYJ-40035-64P-PCB

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CAD Model

Pb

A

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ARRAYJ-400XX-64P-PCB

1

260

UNTBX

1

Y

Array

8 x 8

4 mm x 4 mm

35

420

50

50

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ARRAYJ-60035-4P-BGA

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CAD Model

Pb

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ARRAYJ-600XX-4P

1

260

UNTBX

1

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Array

2 x 2

6 mm x 6 mm

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50

50

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ARRAYJ-60035-4P-PCB

Active

CAD Model

Pb

A

H

P

ARRAYJ-600XX-4P-PCB

1

260

UNTBX

1

Y

Array

2 x 2

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

ARRAYJ-60035-64P-PCB

Active

CAD Model

Pb

A

H

P

ARRAYJ-600XX-64P-PCB

1

260

UNTBX

1

Y

Array

8 x 8

6 mm x 6 mm

35

420

50

50

Price N/A

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