J 系列 SiPM 传感器的高填充系数阵列: 安森美半导体的 J 系列硅光电倍增 (SiPM) 传感器用于生产高填充系数、可扩展阵列。TSV 封装的传感器安装在 PCB 板上,死区空间很少。该 ArrayJ 产品提供多种格式,由 3 mm、4 mm 或 6 mm 像素组成。每个 ArrayJ 的背部都有一个或多个多路接头或 BGA(球形焊点阵列),可用于访问每个像素标准输出,在某些情况下还可以访问快速输出。
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可靠性数据
Die Related Summary Data
Device: ARRAYJ-30020-16P-PCB
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
3
7566029322
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)