C 系列 SiPM 传感器 4 面可扩展阵列 安森美半导体的 C 系列硅光电倍增 (SiPM) 传感器用于生产紧凑的可扩展阵列。采用 MLP 封装的此类传感器安装在具有最小死区空间的 PCB 板上,可提供多种形式,可由 1 mm、3 mm 或 6 mm 传感器组成。每个 ArrayC 的背面都具有多路联接器或球形焊点阵列 (BGA),提供对于快速*和标准输出的访问,以及来自像素总和基质的公共 I/O。 * 请注意 ARRAYC-60035-4P-BGA 没有快速输出。
搜寻
Close Search
产品:
4
分享
排序方式
产品系列:
┗
可订购器件:
4
产品
状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Type
Array Format
Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
参考价格
Show More
1-25 of 25
Products per page
Jump to :
支持服务
联系安森美销售团队获得支持,查询或者对比产品细节。
联系销售
分享
导出
Rows
Printer Friendly Version
PDF Format
Excel Format
CSV Format
To proceed order you need to accept Terms
可靠性数据
Die Related Summary Data
Device: ARRAYC-30035-144P-PCB
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
3
7566029322
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)