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C 系列 SiPM 传感器 4 面可扩展阵列 安森美半导体的 C 系列硅光电倍增 (SiPM) 传感器用于生产紧凑的可扩展阵列。采用 MLP 封装的此类传感器安装在具有最小死区空间的 PCB 板上,可提供多种形式,可由 1 mm、3 mm 或 6 mm 传感器组成。每个 ArrayC 的背面都具有多路联接器或球形焊点阵列 (BGA),提供对于快速*和标准输出的访问,以及来自像素总和基质的公共 I/O。 * 请注意 ARRAYC-60035-4P-BGA 没有快速输出。
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Active Area Dimensions
Microcell Size (µm)
Optimized Wavelength (nm)
PDE @ Max Overvoltage (%)
DCR @ Typical Overvoltage (KHz/mm2)
Reference Price
ARRAYC-30035-144P-PCB
Active
Pb
A
H
P
ARRAYC-300XX-144P-PCB
1
260
UNTBX
1
Y
Array
12 x 12
3 mm x 3 mm
35
420
41
30
Price N/A
More Details
ARRAYC-30035-16P-PCB
Active
Pb
A
H
P
ARRAYC-300XX-16P-PCB
1
260
UNTBX
1
Y
Array
4 x 4
3 mm x 3 mm
35
420
41
30
Price N/A
More Details
ARRAYC-60035-4P-BGA
Active
Pb
A
H
P
ARRAYC-600XX-4P-BGA
1
260
UNTBX
1
Y
Array
2 x 2
6 mm x 6 mm
35
420
41
30
Price N/A
More Details
ARRAYC-60035-64P-PCB
Active
Pb
A
H
P
ARRAYC-600XX-64P-PCB
1
260
UNTBX
1
Y
Array
8 x 8
6 mm x 6 mm
35
420
41
30
Price N/A
More Details
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可靠性数据
Die Related Summary Data
Device: ARRAYC-30035-144P-PCB
Equivalent to wafer fab process: CMOS SUB
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
CMOS SUB
2
920154574
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)